Xiaomi has officially introduced its in-house XRING 01 chipset
Xiaomi has officially introduced its in-house XRING 01 chipset, marking a major milestone in the company’s pursuit of self-reliant core technology. CEO Lei Jun revealed that the project was the result of a decade-long research and development journey, supported by a staggering 105 billion yuan ($14.5 billion) investment over the past five years.
A 10-Year Vision Realized
In a recent speech, Lei Jun emphasized that the XRING 01 represents one of the most ambitious technology projects in Xiaomi’s history. Although the company has previously dabbled in custom chip development, nothing has come close to the scale or complexity of this effort.
The journey to XRING 01’s launch took 10 years of persistent innovation, including the recruitment of over 1,000 specialists, many of whom were industry veterans. Notably, a former Qualcomm senior director was brought on board to oversee the entire SoC division and report directly to the CEO.
Massive R&D Investment in 2025 Alone
According to Lei Jun, Xiaomi invested more than 30 billion yuan (~$4.1 billion) in R&D in 2025 alone. While not all of it was dedicated solely to the XRING 01, a substantial portion likely fueled its development. The XRING 01 is considered a key breakthrough in Xiaomi’s goal to reduce its reliance on third-party chipmakers like Qualcomm and MediaTek.
Why XRING 01 Matters to Xiaomi’s Future
By developing its own custom chipset, Xiaomi aims to gain tighter integration between hardware and software, a strategy similar to what Apple has achieved with its A-series and M-series chips. This move is expected to enhance performance, efficiency, and product differentiation, enabling Xiaomi to stand out in a highly competitive tech landscape.
Lei Jun stated that building core technologies is essential to Xiaomi’s long-term growth. The XRING 01 chipset is a major step toward that goal, setting the foundation for more innovation in smartphones, wearables, and IoT devices.
Manufacturing Details and Technical Insights
While official specs of the XRING 01 remain under wraps, earlier reports suggest that the chip is being manufactured using TSMC’s 4nm process. However, it may rely on ARM’s older CPU architectures rather than fully custom-designed cores—indicating this is still an early step in Xiaomi’s chipset evolution.
A Long Road Marked by Challenges
Lei Jun acknowledged that Xiaomi’s journey hasn’t been smooth. He cited 2019 as a particularly tough year for the company, with significant internal and external challenges. Despite the setbacks, Xiaomi remained committed to its mission of technological independence.
In his speech, Lei Jun praised the company’s resilience and forward-thinking vision, attributing the success of the XRING 01 to a bold strategy that few competitors have dared to pursue.
Looking Ahead
The XRING 01 chipset is expected to be officially launched later this month. While it’s not yet clear which Xiaomi devices will debut with the new chip, the announcement signals a bold shift in the company’s future direction—one centered around core innovation, independence, and global competitiveness.
Stay tuned for more updates as Xiaomi reveals full specifications and device rollouts powered by the XRING 01.